The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jan. 23, 2018
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventor:

Nan-Jang Chen, Hsinchu, TW;

Assignee:

MediaTek, Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01P 3/08 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01P 3/08 (2013.01); H05K 1/0224 (2013.01); H05K 1/05 (2013.01); H05K 1/0218 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01);
Abstract

A printed circuit board (PCB) is disclosed. The PCB includes a substrate have a top surface and a bottom surface. A first conductive layer is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net and a second signal net. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening to expose a portion of the second signal net. A second conductive layer is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential.


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