The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10484162 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 19, 2019

Filed:

Mar. 05, 2018
Applicant:

Zte Corporation, Shenzhen, CN;

Inventors:

Anming Jiang, Shenzhen, CN;

Bo Sun, Shenzhen, CN;

Nan Li, Shenzhen, CN;

Yonggang Fang, San Diego, CA (US);

Assignee:

ZTE Corporation, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03D 1/04 (2006.01); H04B 7/208 (2006.01); H04J 11/00 (2006.01); H04L 5/14 (2006.01); H04L 5/16 (2006.01); H04L 27/00 (2006.01); H04L 5/00 (2006.01);
U.S. Cl.
CPC ...
H04L 5/143 (2013.01); H04L 5/16 (2013.01); H04L 27/0006 (2013.01); H04L 5/0007 (2013.01); H04L 5/1492 (2013.01);
Abstract

In a wireless network, full duplex communication is established using a half-duplex mechanism. During a full duplex communication opportunity, a first quantum of data is transmitted from a first station to a second station and a second quantum of data is received by the first station from the second station. The full duplex transmission opportunity is implicitly or explicitly established and ended using a transmission mechanism understood by half duplex wireless stations.


Find Patent Forward Citations

Jiang, Anming. (2019). Full duplex transmission setup and release mechanism (U.S. Patent No. 10484162). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10484162

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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