logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483908 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

May. 24, 2017

Wearable power management system

Applicant:

Man Qing Kang, Shenzhen, CN;

Inventor:

Man Qing Kang, Shenzhen, CN;

Assignee:

SHENZHEN DANSHA TECHNOLOGY CO., LTD., Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:

Bach T Dinh

Int. Cl.
CPC ...
H01L 31/044 (2014.01); H02S 40/38 (2014.01); H01L 31/05 (2014.01); H01L 31/048 (2014.01); H01M 10/0525 (2010.01); H01M 10/46 (2006.01); H01M 2/20 (2006.01); H01M 16/00 (2006.01); H01L 31/042 (2014.01); H01L 31/053 (2014.01);
U.S. Cl.
CPC ...
H02S 40/38 (2014.12); H01L 31/042 (2013.01); H01L 31/048 (2013.01); H01L 31/0481 (2013.01); H01L 31/053 (2014.12); H01L 31/0508 (2013.01); H01L 31/0512 (2013.01); H01M 2/204 (2013.01); H01M 10/0525 (2013.01); H01M 10/465 (2013.01); H01M 16/00 (2013.01); H01M 2220/30 (2013.01); Y02E 60/122 (2013.01);
Abstract

A wearable power management system includes: a bottom coating layer; a bottom center layer disposed above the bottom coating layer; a circuit layer disposed above the bottom center layer; a top center layer disposed above the circuit layer, and a top coating layer disposed above the top center layer. The bottom center layer and the top center layer are made of an ultra-low Young's modulus material. The Young's modulus of the bottom coating layer and the top coating layer is greater than the Young's modulus of the bottom center layer and the top center layer. The circuit layer includes a device layer and a connection layer disposed above the device layer.

Find Patent Forward Citations

Loading…