The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jan. 04, 2019
Applicant:

Delta Electronics (Shanghai) Co.,ltd., Shanghai, CN;

Inventors:

Peiai You, Shanghai, CN;

Hao Sun, Shanghai, CN;

Jinfa Zhang, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 1/32 (2007.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02M 1/32 (2013.01); H05K 7/20272 (2013.01); H05K 7/20327 (2013.01); H05K 7/20381 (2013.01); H02M 2001/327 (2013.01);
Abstract

A power conversion apparatus is provided, which comprises a housing, a mother board, an electromagnetic filter board, a signal board, and a heat-dissipation module. The housing includes a first heat-dissipation wall and a coolant passage. The mother board is disposed upon the housing, and comprises a first surface facing the housing and a first power device. The heat-dissipation module includes a first insulated heat-conducting sheet adhered to the corresponding first heat-dissipation wall and a first elastic clamp. When the first surface of the mother board approaches the housing to clamp the first power device within the accommodating space, the first power device is pressed against by the first elastic clamp and thus adhered to the first insulated heat-conducting sheet, so that the first power device is thermally coupled to the first heat-dissipation wall and the coolant passage via the first insulated heat-conducting sheet.


Find Patent Forward Citations

Loading…