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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483666 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Mar. 29, 2018

Socket receiving an electronic component having a plurality of contact pads

Applicant:

Tyco Electronics Japan G.k., Kanagawa, JP;

Inventor:

Hidenori Taguchi, Kanagawa, JP;

Assignee:

Tyco Electronics Japan G.K., Kanagawa, JP;

Attorney:

Barley Snyder

Primary Examiner:

Travis S Chambers

Int. Cl.
CPC ...
H01R 12/70 (2011.01); H01R 13/24 (2006.01); H01R 13/405 (2006.01); H01R 12/71 (2011.01); H05K 7/10 (2006.01); H01R 4/02 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/714 (2013.01); H01R 13/24 (2013.01); H01R 13/2442 (2013.01); H01R 13/405 (2013.01); H05K 7/1038 (2013.01); H01R 4/028 (2013.01); H01R 12/58 (2013.01);
Abstract

A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways each extending through the housing and having an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on the first surface of the housing that is electrically continuous with the conductive material of the inner wall surface. Each of the contacts includes a contact portion positioned above the first surface of the housing and configured to be elastically deformed by a contact pad electrically connected with the contact, an insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway, and a joint portion joined to the conductive pad.

Find Patent Forward Citations

Taguchi, Hidenori. (2019). Socket receiving an electronic component having a plurality of contact pads (U.S. Patent No. 10483666). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10483666

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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