The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

May. 30, 2018
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yanmin Yu, Shenzhen, CN;

Jian Song, Shenzhen, CN;

Dingjiu Daojian, Munich, DE;

Peng Liu, Xi'an, CN;

Assignee:

HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 21/00 (2006.01); H01Q 5/328 (2015.01); H01Q 1/24 (2006.01); H01Q 21/26 (2006.01); H01Q 21/29 (2006.01); H01Q 21/30 (2006.01); H01Q 15/14 (2006.01); H01Q 21/28 (2006.01); H01Q 5/48 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/521 (2013.01); H01Q 1/246 (2013.01); H01Q 5/328 (2015.01); H01Q 5/48 (2015.01); H01Q 15/14 (2013.01); H01Q 21/0031 (2013.01); H01Q 21/26 (2013.01); H01Q 21/28 (2013.01); H01Q 21/293 (2013.01); H01Q 21/30 (2013.01);
Abstract

Embodiments of the present invention provide a multi-frequency communications antenna and a base station. The multi-frequency communications antenna includes at least one low-frequency array, at least one high-frequency array, at least one circuit board disposed corresponding to the high-frequency array, and a reflection panel, where a filtering component configured to decouple filtering is disposed on the circuit board, a first end of the filtering component is electrically connected to the high-frequency array, and a second end of the filtering component is electrically connected to a signal ground layer of the circuit board. The filtering component configured to decouple filtering that is shown in this embodiment is disposed on the circuit board, which causes a small damage to an array radiation environment.


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