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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483618 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Jun. 05, 2018

Semiconductor package and manufacturing method thereof

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Wook Park, Suwon-si, KR;

Tah Joon Park, Suwon-si, KR;

Jae Hyun Jung, Suwon-si, KR;

Hwa Sun Lee, Suwon-si, KR;

Seong Hun Na, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Thanh T Nguyen

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H01Q 1/44 (2006.01); G06K 19/077 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 1/40 (2006.01); H01Q 21/30 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); G06K 19/07749 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/97 (2013.01); H01Q 1/44 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0407 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01Q 1/40 (2013.01); H01Q 21/30 (2013.01);
Abstract

A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.

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