The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Oct. 25, 2017
Fairchild Korea Semiconductor Ltd., Bucheon, KR;
Mankyo Jong, Bucheon-si, KR;
Changyoung Park, Ilsan-si, KR;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
In a general aspect, a circuit assembly apparatus can include first and second semiconductor die, and a substrate. The substrate can include an insulating layer; a first metal layer disposed on a first side of the insulating layer, a first side of the first semiconductor die disposed on and electrically coupled with the first metal layer; a second metal layer disposed on a second side of the insulating layer, the second side of the insulating layer being opposite the first side of the insulating layer, a first side of the second semiconductor die being disposed on and electrically coupled with the second metal layer; and a conductive via disposed through the insulating layer, the conductive via electrically coupling the first metal layer with the second metal layer, the first metal layer, the conductive via and the second metal layer electrically coupling the first semiconductor die with the second semiconductor die.