The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483218 B1

Date of Patent:

Nov. 19, 2019

Filed:

May. 31, 2019

Integrated circuit (ic) devices with varying diameter via layer

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventor:

William Michael Stone, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Loza & Loza, LLP/Qualcomm

Primary Examiner:

Alonzo Chambliss

Int. Cl.

CPC ...

H01L 23/12 (2006.01); H01L 21/4763 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);

U.S. Cl.

CPC ...

H01L 23/562 (2013.01); H01L 21/563 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/3171 (2013.01); H01L 23/49816 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/35121 (2013.01);

Abstract

An integrated circuit (IC) device that includes an IC device layer, at least one electrical connection layer located over the IC device layer, and a varying diameter via layer located over the at least one electrical connection layer. The varying diameter via layer includes (i) an interior region having a plurality of interior region vias and (ii) a perimeter region having a plurality of perimeter region vias. The plurality of interior region vias of the interior region is larger than the plurality of perimeter region vias of the perimeter region. The varying diameter via layer comprises an interior surface that is coupled to an interior surface of the at least one electrical connection layer.

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