The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jun. 09, 2017
Applicant:

Nikon Corporation, Tokyo, JP;

Inventors:

Isao Sugaya, Kawasaki, JP;

Kazuya Okamoto, Yokohama, JP;

Hajime Mitsuishi, Yokohama, JP;

Minoru Fukuda, Tokyo, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/544 (2006.01); B65H 31/34 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01); B23K 37/04 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/24 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B23K 20/002 (2013.01); B23K 20/023 (2013.01); B23K 20/24 (2013.01); B23K 37/0408 (2013.01); B65H 31/34 (2013.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/68 (2013.01); H01L 21/681 (2013.01); H01L 21/6831 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 24/75 (2013.01); H01L 24/94 (2013.01); B23K 2101/40 (2018.08); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/75724 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.


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