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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483210 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Nov. 04, 2015

Glass articles with non-planar features and alkali-free glass elements

Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Timothy Michael Gross, Corning, NY (US);

Paul John Shustack, Elmira, NY (US);

Wendell Porter Weeks, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:

Jeffrey A. Schmidt

Primary Examiner:

Sophia T Nguyen

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 51/52 (2006.01); H01L 23/15 (2006.01); H01L 29/786 (2006.01); H01L 51/56 (2006.01); B32B 17/06 (2006.01); C03C 15/00 (2006.01); C03C 17/00 (2006.01); C03C 17/32 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5387 (2013.01); B32B 17/064 (2013.01); C03C 15/00 (2013.01); C03C 17/007 (2013.01); C03C 17/322 (2013.01); C03C 17/326 (2013.01); H01L 23/15 (2013.01); H01L 29/78603 (2013.01); H01L 51/0097 (2013.01); H01L 51/524 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); B32B 2457/206 (2013.01); C03C 2217/43 (2013.01); C03C 2217/445 (2013.01); C03C 2217/478 (2013.01); H01L 2251/303 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 μm to about 100 μm. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.

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