The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 04, 2018
Applicant:

Honda Motor Co., Ltd., Minato-ku, Tokyo, JP;

Inventors:

Takahiro Uneme, Wako, JP;

Yuko Yamada, Wako, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H05K 7/14 (2006.01); B60L 53/20 (2019.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4012 (2013.01); B60L 53/20 (2019.02); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H05K 7/1432 (2013.01); H05K 7/20927 (2013.01);
Abstract

A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.


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