The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 15, 2018
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;

Inventor:

Masataka Deguchi, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); F28F 21/02 (2006.01); H01L 23/492 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); F28F 21/02 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2924/181 (2013.01);
Abstract

A first inner heat conductor may include a plurality of first graphite layers. A second inner heat conductor may include a plurality of second graphite layers. The plurality of first graphite layers may be stacked in a first direction which is orthogonal to a direction in which a semiconductor element and a first heat radiator are arranged. The plurality of second graphite layers may be stacked in the direction in which the semiconductor element and the first heat radiator are arranged, or may be stacked in a second direction which is orthogonal to the direction in which the semiconductor element and the first heat radiator are arranged and orthogonal to the first direction.


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