The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 18, 2018
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Norimune Orimoto, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 23/367 (2006.01); H01L 23/492 (2006.01); H01L 21/66 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 22/34 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 23/42 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device may include a semiconductor element; a temperature detecting element provided at a central part of a surface of the semiconductor element, and a heat conductor jointed to the surface of the semiconductor element via a jointing element. The jointing element may include a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element. The heat conductor may include a metal part being in contact with the central part of the jointing element, and a graphite part being in contact with the peripheral part of the jointing element.


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