The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

May. 24, 2016
Applicant:

Noda Screen Co., Ltd., Aichi, JP;

Inventor:

Seisei Oyamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/32 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/32 (2013.01); H01L 21/4853 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/647 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/02 (2013.01); H01L 24/13 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16227 (2013.01);
Abstract

An intermediate connector includes a power source bus bar as an elongated thin plate to be connected to each power source pad of a semiconductor integrated circuit, a ground bus bar as an elongated thin plate to be connected to each ground pad of the semiconductor integrated circuit, a thin film insulator layer formed between the power source bus bar and the ground bus bar, and a conductive path portion as an elongated thin plate including a plurality of conductive paths to be connected to each signal pad of the semiconductor integrated circuit. The power source bus bar, the ground bus bar, and the conductive path portion are arranged in parallel correspondingly to a parallel arrangement of a power source pad row, a ground pad row, and a signal pad row of the semiconductor integrated circuit.


Find Patent Forward Citations

Oyamada, Seisei. (2019). Intermediate connector, semiconductor device including intermediate connector, and method of manufacturing intermediate connector (U.S. Patent No. 10483182). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10483182

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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