The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Nov. 23, 2017
Fuji Electric Co., Ltd., Kanagawa, JP;
Yoshihiro Yasuda, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
To enhance the reliability of a semiconductor device. A semiconductor device is provided that includes a semiconductor element having a first pad, a frame member having a second pad, a connection member that contains at least one of copper and silver and connects the first pad and the second pad, and a sealing portion that is formed of resin composition containing no sulfur and seals the semiconductor element, the frame member, and the connection member, wherein arithmetic mean roughness of an upper surface of the first pad is equal to or greater than 0.02 μm. Arithmetic mean roughness of an upper surface of the second pad may be greater than the arithmetic mean roughness of the first pad. Sulfur content contained in the resin composition may be less than NHion content contained in the resin composition.