The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Nov. 20, 2018
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Mohammad Nosrati, Redwood City, CA (US);

Kevin Ptasienski, O'Fallon, MO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/6875 (2013.01); H01L 21/68785 (2013.01); H05K 1/0212 (2013.01); H05K 1/0224 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H01Q 1/38 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A ceramic pedestal assembly and a method of forming a ceramic pedestal assembly is provided. The ceramic pedestal assembly includes a ceramic substrate defining an upper surface and a lower surface, at least one via extending through the ceramic substrate, an upper conductive foil layer extending across the upper surface of the ceramic substrate and a lower conductive foil layer extending across the lower surface of the ceramic substrate. Each via includes an upper via defining a cavity and a lower via defining a corresponding tapered insert. In one form, the upper via, the lower via, and the conductive foil layers define a material having a melting temperature greater than 2,000° C. and a CTE less than or equal to the ceramic substrate.


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