The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483126 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 19, 2019

Filed:

Sep. 07, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Takashi Izumi, Yokkaichi, JP;

Fumitoshi Ikegaya, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/67 (2006.01); C25D 17/00 (2006.01); C25D 5/48 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01); C25D 5/48 (2013.01); H01L 21/67023 (2013.01); H01L 21/67051 (2013.01); C25D 17/001 (2013.01); H01L 21/02087 (2013.01);
Abstract

A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.


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Izumi, Takashi. (2019). Semiconductor manufacturing apparatus and manufacturing method of semiconductor device (U.S. Patent No. 10483126). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10483126

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