The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Apr. 04, 2018
Applicant:

Life Technologies Corporation, Carlsbad, CA (US);

Inventors:

Phil Waggoner, Guilford, CT (US);

Jordan Owens, Austin, TX (US);

Assignee:

LIFE TECHNOLOGIES CORPORATION, Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); G01N 27/414 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); G01N 27/4146 (2013.01); G01N 27/4148 (2013.01); H01L 21/0206 (2013.01); H01L 21/0271 (2013.01); H01L 21/28556 (2013.01); H01L 21/31111 (2013.01); H01L 21/32133 (2013.01);
Abstract

A method for forming a well providing access to a sensor pad includes patterning a first photoresist layer over a dielectric structure disposed over the sensor pad; etching a first access into the dielectric structure and over the sensor pad, the first access having a first characteristic diameter; patterning a second photoresist layer over the dielectric structure; and etching a second access over the dielectric structure and over the sensor pad. The second access has a second characteristic diameter. The first and second accesses overlapping. A diameter ratio of the first characteristic diameter to the second characteristic diameter is not greater than 0.7. The first access exposes the sensor pad. The second access has a bottom depth less than a bottom depth of the first access.


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