The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Aug. 13, 2018
Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Minato-ku, Tokyo, JP;

Inventors:

Norio Yoshikawa, Yokohama Kanagawa, JP;

Yoshihiro Amemiya, Chigasaki Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4846 (2013.01); G11B 5/4853 (2013.01);
Abstract

According to one embodiment, a flexible printed wiring board includes a base insulation layer, first wirings Won the base insulation layer, an intermediate insulation layer overlapped with the first wirings, connection pads on the intermediate insulation layer, a cover insulation layer overlapped with the connection pads and the intermediate insulation layer and including openings through which the connection pads are exposed to the cover layer, and conductive vias MT electrically connecting the first wirings to at least a part of the connection pads respectively. The conductive vias are overlapped with the connection pads in a thickness direction of the flexible printed wiring board.


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