The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jun. 26, 2018
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

Robert Boyd Curtis, Georgetown, TX (US);

Corey Dean Hartman, Hutto, TX (US);

Jonathan Foster Lewis, Round Rock, TX (US);

Assignee:

Dell Products, L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G06F 1/18 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); G06F 1/184 (2013.01); H05K 1/0209 (2013.01); H05K 7/20145 (2013.01); H05K 7/20172 (2013.01); H05K 7/20209 (2013.01); G06F 2200/201 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01);
Abstract

Components installed on a topside of printed circuit board (PCB), such as a motherboard, are provided airflow cooling by a plurality of cooling fans located on a proximal end of the PCB. A hardware component is installed on the topside of a distal end of the PCB, furthest from the cooling fans. The hardware component includes cooling elements that extend to the underside of the PCB. Cooling the hardware component is complicated by the distance from the cooling fans and the cooling elements that extend below the PCB. A plenum extending from the proximal end of the PCB towards the distal end of the PCB is installed on the underside of the PCB. The plenum draws airflow from the cooling fans and delivers the airflow to the hardware component along the underside of the PCB, thus avoiding heating by the components on the topside of the PCB.


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