The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Feb. 09, 2018
Applicant:

Uatc, Llc, San Francisco, CA (US);

Inventors:

David Patrick Rice, Wexford, PA (US);

Thomas Jeffrey Watson, Pittsburgh, PA (US);

John William Zinn, Canonsburg, PA (US);

Robert Henry Doll, Allison Park, PA (US);

Declan Seamus Kelly, Pittsburgh, PA (US);

Assignee:

UATC, LLC, San Francisco, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); B60R 16/023 (2006.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); B60R 16/0231 (2013.01); F28D 15/0275 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H05K 7/20136 (2013.01); H05K 7/20254 (2013.01); H05K 7/20336 (2013.01); H05K 7/20854 (2013.01); H05K 7/20863 (2013.01); H05K 7/20881 (2013.01); H05K 7/20927 (2013.01); B60Y 2306/05 (2013.01); G06F 2200/201 (2013.01);
Abstract

Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.


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