The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jun. 25, 2018
Applicants:

Liji Huang, Santa Clara, CA (US);

Chih-chang Chen, Cupertino, CA (US);

Inventors:

Liji Huang, Santa Clara, CA (US);

Chih-Chang Chen, Cupertino, CA (US);

Assignee:

SIARGO LTd., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/692 (2006.01); G01F 1/708 (2006.01); G01F 7/00 (2006.01); G01F 1/684 (2006.01); G01F 1/696 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); G01F 1/6845 (2013.01); G01F 1/7084 (2013.01); G01F 7/00 (2013.01); G01F 1/696 (2013.01);
Abstract

The present invention disclosed a micromachined composite silicon flow sensor that is comprised of calorimetric flow sensing elements, time-of-flight sensing elements as well as independent temperature sensing element on a silicon-on-insulator device where the device layer is used for the thermal isolation membrane. The disclosed composite silicon flow sensor can measure mass flowrate, volumetric flowrate and flow medium temperature simultaneously, from which a full spectrum of flow parameters including flow pressure can be obtained. The sensor can be further used to alert any changes in physical properties of flow medium during operation. The disclosed manufacture process details the micromachining process of making such a sensor.


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