The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Aug. 17, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Raymond Kirk Price, Redmond, WA (US);

Christopher John McMillan, Woodinville, WA (US);

Rachel Leigh Peters, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/20 (2016.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); F21V 29/70 (2015.01); H04N 5/225 (2006.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
F21K 9/20 (2016.08); F21V 29/70 (2015.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H04N 5/2256 (2013.01); H04N 5/2257 (2013.01); H01L 33/54 (2013.01);
Abstract

PCBs, PCB components and PCB assemblies are provided with mounting configurations and structures for reducing Z height dimensions of the PCB assemblies and, in some instances, for improving thermal conductivity of the PCB components and assemblies. The active illumination device/source or other PCB components (e.g., camera modules and LED packages) are affixed to a mounting substrate that has a top surface that is physically and electrically mounted to a bottom surface of a PCB, with at least a portion of the active illumination device/source being concurrently positioned within one or more holes in the PCB. A thermal interface in contact with at least the mounting substrate can also be used for dissipating heat from the PCB components and PCB.


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