The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Nov. 05, 2018
Applicant:

Smith International, Inc., Houston, TX (US);

Inventors:

J. Daniel Belnap, Lindon, UT (US);

Georgiy Voronin, Orem, UT (US);

Feng Yu, Lindon, UT (US);

Peter T. Cariveau, Houston, TX (US);

Youhe Zhang, Spring, TX (US);

Yuelin Shen, Spring, TX (US);

Guodong Zhan, Spring, TX (US);

Assignee:

SMITH INTERNATIONAL, INC., Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/55 (2006.01); E21B 10/567 (2006.01); B01J 3/06 (2006.01); B22F 5/00 (2006.01); C22C 26/00 (2006.01); E21B 10/573 (2006.01); B24D 3/10 (2006.01); B22F 3/24 (2006.01);
U.S. Cl.
CPC ...
E21B 10/55 (2013.01); E21B 10/567 (2013.01); B01J 3/062 (2013.01); B01J 2203/062 (2013.01); B01J 2203/0655 (2013.01); B01J 2203/0685 (2013.01); B22F 2003/244 (2013.01); B22F 2005/001 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B24D 3/10 (2013.01); C22C 26/00 (2013.01); C22C 2026/006 (2013.01); E21B 10/5735 (2013.01);
Abstract

The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.


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