The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jan. 18, 2018
Applicant:
Asm America, Inc., Phoenix, AZ (US);
Inventors:
Michael W. Halpin, Scottsdale, AZ (US);
Paul T. Jacobson, Phoenix, AZ (US);
Assignee:
ASM America, Inc., Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 31/12 (2006.01); C30B 25/16 (2006.01); C30B 25/10 (2006.01); C30B 29/06 (2006.01); C23C 16/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/16 (2013.01); C23C 16/02 (2013.01); C23C 16/0209 (2013.01); C30B 25/10 (2013.01); C30B 29/06 (2013.01);
Abstract
A system and methods are provided for low temperature, rapid baking to remove impurities from a semiconductor surface prior to in-situ deposition. The system is configured with an upper bank of heat elements perpendicular to the gas flow path, such that when the substrate is heated, the temperature across the substrate can be maintained relatively uniform via zoned heating. Advantageously, a short, low temperature process is suitable for advanced, high density circuits with shallow junctions. Furthermore, throughput is greatly improved by the low temperature bake.