The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

May. 28, 2014
Applicant:

Ntn Corporation, Osaka-shi, JP;

Inventors:

Masashi Kitai, Iwata, JP;

Kohei Higashi, Iwata, JP;

Hidekazu Hirano, Iwata, JP;

Hajime Isa, Iwata, JP;

Masanori Nishira, Yamatokoriyama, JP;

Hitoshi Shiotani, Yamatokoriyama, JP;

Keiji Iwamoto, Yamatokoriyama, JP;

Youhei Migaki, Yamatokoriyama, JP;

Assignee:

NTN Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 5/10 (2006.01); C10M 173/02 (2006.01); B24C 1/08 (2006.01); C10M 105/24 (2006.01); C10M 129/08 (2006.01); C10M 129/16 (2006.01); C10M 133/08 (2006.01);
U.S. Cl.
CPC ...
C09K 5/10 (2013.01); B24C 1/08 (2013.01); C10M 105/24 (2013.01); C10M 129/08 (2013.01); C10M 129/16 (2013.01); C10M 133/08 (2013.01); C10M 173/02 (2013.01); C10M 2207/022 (2013.01); C10M 2207/046 (2013.01); C10M 2207/126 (2013.01); C10M 2209/104 (2013.01); C10M 2209/108 (2013.01); C10M 2215/04 (2013.01); C10M 2215/042 (2013.01); C10M 2219/024 (2013.01); C10N 2230/06 (2013.01); C10N 2230/12 (2013.01); C10N 2240/401 (2013.01); C10N 2240/408 (2013.01);
Abstract

The present invention addresses the problem of providing a water-soluble cutting or grinding fluid that has excellent permeability and washability, that can be widely used in cutting or grinding, and that is particularly suitable for use in superfinishing. The present invention provides a water-soluble cutting or grinding fluid that contains a glycol compound (A), at least one substance (B) selected from the group consisting of organic amines and inorganic alkalis, a surfactant (C), and water (D), the water-soluble cutting or grinding fluid having a contact angle of 2 to 15° as measured using the θ/2 method one second after a drop of a dilution of the water-soluble cutting or grinding fluid is dropped on an SPCC-SB plate.


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