The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Apr. 28, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventor:

Dezhi Xu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 1/00 (2006.01); H01L 23/00 (2006.01); C09J 11/08 (2006.01); C08K 9/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 1/00 (2013.01); C09J 11/08 (2013.01); H01L 24/29 (2013.01); C08K 9/00 (2013.01); C08K 2201/001 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/29693 (2013.01);
Abstract

The present disclosure provides a conductive particle and a preparation method thereof, a conductive adhesive and a display device. The preparation method comprises steps of: forming cores; dispersing the spherical cores in deionized water and adding organic polymeric monomers so as to form a reaction solution; radiating the reaction solution with γ rays so that the organic polymeric monomers are polymerized on surfaces of the cores so as to form organic polymers; separating the spherical cores formed with the organic polymers on their surfaces from the reaction solution so as to obtain them; successively carrying out preoxidation and carbonization treatment on the cores formed with the organic polymers on their surfaces so that the organic polymers form a conductive layer consisting of carbon particles so as to obtain conductive particles each consisting of the conductive layer and the core.


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