The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jan. 18, 2016
Applicant:
Magma Flooring Llc, River Falls, WI (US);
Inventors:
Greggory S Bennett, Hudson, WI (US);
Jeffrey Jacob Cernohous, Hudson, WI (US);
Vance Warren Zins, Hudson, WI (US);
Todd Richard Samstrom, Ellsworth, WI (US);
Assignee:
MAGMA FLOORING LLC, River Falls, WI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 5/26 (2006.01); C08J 5/18 (2006.01); C08K 3/00 (2018.01); C08K 5/00 (2006.01); C08K 7/14 (2006.01); E04C 1/00 (2006.01); C08K 3/01 (2018.01); C08J 5/04 (2006.01); B29C 70/50 (2006.01); E04C 2/22 (2006.01);
U.S. Cl.
CPC ...
B32B 27/28 (2013.01); B29C 70/506 (2013.01); B32B 5/26 (2013.01); C08J 5/043 (2013.01); C08J 5/18 (2013.01); C08K 3/00 (2013.01); C08K 3/01 (2018.01); C08K 5/00 (2013.01); C08K 5/0008 (2013.01); C08K 7/14 (2013.01); E04C 1/00 (2013.01); E04C 2/22 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/04 (2013.01); B32B 2264/06 (2013.01); B32B 2264/067 (2013.01); B32B 2264/10 (2013.01); B32B 2307/30 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01); B32B 2419/04 (2013.01); C08J 2323/06 (2013.01); C08J 2323/12 (2013.01); C08J 2327/06 (2013.01);
Abstract
A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient over conventionally filled thermoplastic substrates or other fiberglass reinforced thermoplastics.