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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10479048 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Sep. 18, 2017

Bonding arrangement and production method

Applicant:

Airbus Operations Gmbh, Hamburg, DE;

Inventors:

Matthias Hegenbart, Hamburg, DE;

Hermann Benthien, Hamburg, DE;

Mika Bots, Hamburg, DE;

Assignee:

Airbus Operations GmbH, , DE;

Attorney:

Lerner, David, Littenberg, Krumholz & Mentlik, LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 3/12 (2006.01); B32B 3/30 (2006.01); B32B 5/18 (2006.01); B32B 7/04 (2019.01); B32B 7/14 (2006.01); B32B 15/00 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 25/00 (2006.01); B32B 25/14 (2006.01); B32B 1/04 (2006.01); B32B 3/00 (2006.01); B32B 3/02 (2006.01); B32B 3/06 (2006.01); B32B 3/22 (2006.01); B32B 3/26 (2006.01); B32B 3/28 (2006.01); B32B 7/05 (2019.01); F16B 11/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B32B 1/04 (2013.01); B32B 3/00 (2013.01); B32B 3/02 (2013.01); B32B 3/06 (2013.01); B32B 3/12 (2013.01); B32B 3/22 (2013.01); B32B 3/26 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 5/18 (2013.01); B32B 7/04 (2013.01); B32B 7/05 (2019.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 15/00 (2013.01); B32B 15/046 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 25/00 (2013.01); B32B 25/14 (2013.01); B32B 37/1292 (2013.01); B32B 37/144 (2013.01); F16B 11/006 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2605/00 (2013.01); B32B 2605/18 (2013.01);
Abstract

In order to provide a new and improved bonding arrangement, especially for use in an aircraft or spacecraft, which is designed to overcome problems of bonding arrangements under Mode I loading stress and which is designed or configured particularly to create a bond design which is incapable of locally loading the adhesive bond above the peel strength, a bonding arrangement is disclosed with a coating structure, which is split into a plurality of neighboring structural elements spatially separated from each other, and at least one supporting member is provided, which comprises a plurality of recesses receiving the structural elements in operating position.

Find Patent Forward Citations

Hegenbart, Matthias. (2019). Bonding arrangement and production method (U.S. Patent No. 10479048). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10479048

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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