The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 27, 2016
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hideaki Ichiki, Tokyo, JP;

Taiga Saito, Tokyo, JP;

Yuo Umei, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B32B 5/08 (2006.01); B29C 43/18 (2006.01); B32B 27/12 (2006.01); B29C 45/14 (2006.01); B32B 5/10 (2006.01); B32B 27/34 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/42 (2006.01); B29K 105/08 (2006.01); B29K 77/00 (2006.01); B29K 105/12 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0005 (2013.01); B29C 43/18 (2013.01); B29C 45/14221 (2013.01); B29C 45/14786 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/026 (2013.01); B32B 5/08 (2013.01); B32B 5/10 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/42 (2013.01); B29K 2077/00 (2013.01); B29K 2105/08 (2013.01); B29K 2105/0881 (2013.01); B29K 2105/12 (2013.01); B29K 2309/08 (2013.01); B29K 2995/0077 (2013.01); B32B 2250/20 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/105 (2013.01); B32B 2262/106 (2013.01); B32B 2262/14 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2605/00 (2013.01);
Abstract

A composite molded article () containing: a thermoplastic resin continuous fiber composite material () containing a continuous reinforcement fiber (A) and a thermoplastic resin (B); and a thermoplastic resin composition (), wherein the thermoplastic resin continuous fiber composite material () is bonded to the thermoplastic resin composition () via a bonding surface, and


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