The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Apr. 07, 2011
Applicants:
SO Young Yoon, Seoul, KR;
Joo Han Lee, Seongnam-si, KR;
Jong Jae Lee, Suwon-si, KR;
Inventors:
Assignee:
EHWA DIAMOND IND. CO., LTD., Osan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/12 (2006.01); B24D 18/00 (2006.01); B24D 3/00 (2006.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01);
Abstract
This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.