The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jul. 07, 2016
Applicants:

Nidec-shimpo Corporation, Nagaokakyo-shi, Kyoto, JP;

Nidec Corporation, Minami-ku, Kyoto, JP;

Inventors:

Tetsuya Iwakuro, Nagaokakyo, JP;

Takayuki Sawada, Nagaokakyo, JP;

Masayuki Otani, Nagaokakyo, JP;

Kazuyoshi Koga, Kyoto, JP;

Takafumi Maeda, Kyoto, JP;

Takeshi Honda, Kyoto, JP;

Nobuyuki Kita, Kyoto, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 55/00 (2006.01); B21D 22/02 (2006.01); G01N 29/44 (2006.01); G01L 5/00 (2006.01); G01N 29/14 (2006.01); G01N 29/04 (2006.01); B21D 28/24 (2006.01);
U.S. Cl.
CPC ...
B21D 55/00 (2013.01); B21D 22/02 (2013.01); B21D 28/24 (2013.01); G01L 5/0076 (2013.01); G01N 29/04 (2013.01); G01N 29/14 (2013.01); G01N 29/4472 (2013.01); G01N 2291/0234 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/2698 (2013.01);
Abstract

Provided is an abnormality prediction system and an abnormality prediction method that are capable of predicting an abnormality occurring in a die that is used in a press machine. A die abnormality prediction system () includes: an acoustic emission (AE) sensor () configured to detect an elastic wave that occurs in a processing portion of a die during processing performed by a press machine using the die; a stamping load detection sensor () configured to detect a parameter (a stamping load) other than a parameter regarding the elastic wave, out of parameters regarding a state of the die during the processing performed by the press machine using the die; a score calculation unit () configured to calculate an abnormality prediction score of the die based on an output signal from the AE sensor () and an output signal from the stamping load detection sensor (); and an abnormality prediction unit () configured to predict an abnormality occurring in the die, based on a result of the calculation performed by the score calculation unit ().


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Iwakuro, Tetsuya. (2019). Die abnormality prediction system, press machine provided with the same, and die abnormality prediction method (U.S. Patent No. 10478887). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10478887

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