The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jan. 03, 2018
Applicant:

All-clad Metalcrafters Llc, Canonsburg, PA (US);

Inventors:

William A. Groll, McMurray, PA (US);

John Watkins, Canonsburg, PA (US);

Assignee:

All-Clad Metalcrafters LLC, Canonsburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A47J 36/02 (2006.01); A47J 37/10 (2006.01); A47J 27/022 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 31/02 (2006.01); B32B 3/26 (2006.01); B32B 15/01 (2006.01); B23K 101/12 (2006.01);
U.S. Cl.
CPC ...
A47J 36/02 (2013.01); A47J 27/022 (2013.01); A47J 37/10 (2013.01); B23K 20/002 (2013.01); B23K 20/023 (2013.01); B23K 31/02 (2013.01); B32B 3/266 (2013.01); B32B 15/012 (2013.01); B23K 2101/12 (2018.08);
Abstract

A method of making cookware containing a bonded composite comprising the steps of providing at least two layers of materials by pressurizing and heating wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles. The method also includes providing a plurality of sets of bonding blank assemblies by solid state processing under pressure and heat.


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