The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Dec. 12, 2018
Applicant:

Auras Technology Co., Ltd., New Taipei, TW;

Inventors:

Chien-An Chen, New Taipei, TW;

Mu-Shu Fan, New Taipei, TW;

Chien-Yu Chen, New Taipei, TW;

Assignee:

AURAS TECHNOLOGY CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/00 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); F28D 15/00 (2013.01); F28F 21/02 (2013.01); F28F 21/082 (2013.01); F28F 21/085 (2013.01); H05K 5/0213 (2013.01); H05K 7/20254 (2013.01); H05K 7/20263 (2013.01); H05K 7/20772 (2013.01);
Abstract

A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.


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