The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jun. 13, 2019
Applicant:

Topline Corporation, Irvine, CA (US);

Inventor:

Martin B. Hart, Irvine, CA (US);

Assignee:

TOPLINE CORPORATION, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H05K 1/111 (2013.01); H05K 3/3494 (2013.01); H05K 2203/0405 (2013.01); H05K 2203/0465 (2013.01);
Abstract

An improved solder column, having a solder core comprising a solder core material, an exoskeleton sleeve structure surrounding at least a majority of an outside surface of the solder core and comprising a plurality of wires woven together to form a mesh, and a plurality of spaces formed in the exoskeleton between the plurality of wires. The exoskeleton sleeve can be configured such that the exoskeleton sleeve will support the solder core so as to prevent a collapse of the solder core at temperatures exceeding a liquidus temperature of the solder core. Optionally, each of the plurality of spaces can have a width and a height that is at least as large as a width of the wire adjacent to the space, and the spaces can be configured to provide additional flexibility to the solder column.


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