The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jun. 22, 2016
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Makiya Ito, Tochigi, JP;

Ryosuke Endo, Tochigi, JP;

Kazuo Goto, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/38 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1208 (2013.01); H05K 1/034 (2013.01); H05K 1/0326 (2013.01); H05K 1/09 (2013.01); H05K 3/381 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1173 (2013.01);
Abstract

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.


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