The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jul. 10, 2017
Applicant:
Schweizer Electronic Ag, Schramberg, DE;
Inventor:
Ali Khoshamouz, Schramberg-Sulgen, DE;
Assignee:
SCHWEIZER ELECTRONIC AG, Schramberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); G01R 15/20 (2006.01); G01R 19/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); G01R 15/207 (2013.01); H05K 1/0204 (2013.01); H05K 1/0263 (2013.01); H05K 1/0265 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/4644 (2013.01); G01R 15/202 (2013.01); G01R 19/0092 (2013.01); H05K 1/0203 (2013.01); H05K 1/0269 (2013.01); H05K 3/0047 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/166 (2013.01);
Abstract
The method for manufacturing a printed circuit board element () having an inlay () and a current sensor () for determining a current flowing in the inlay (), wherein, for the improvement of the positional accuracy of the inlay () relative to the current sensor (), the method comprises the following steps: