The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Aug. 30, 2018
Applicant:

Korea Electronics Technology Institute, Seongnam-si, Gyeonggi-do, KR;

Inventors:

Yoonjin Kim, Suwon-si, KR;

Jinwoo Cho, Seongnam-si, KR;

Kwonwoo Shin, Hwaseong-si, KR;

Yonggon Seo, Seongnam-si, KR;

Yeonwon Kim, Anyang-si, KR;

Sanghyeon Jang, Daejeon, KR;

Namje Jo, Gyeongsangbuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/20 (2006.01); H05K 1/00 (2006.01); C09D 5/24 (2006.01); H05K 1/09 (2006.01); B22F 9/24 (2006.01); C09D 11/52 (2014.01); H01B 1/22 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); C09D 11/037 (2014.01); H05K 3/02 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/095 (2013.01); B22F 1/0022 (2013.01); B22F 1/0074 (2013.01); B22F 1/02 (2013.01); B22F 9/24 (2013.01); C09D 11/037 (2013.01); C09D 11/52 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); H05K 1/097 (2013.01); H05K 3/027 (2013.01); H05K 3/1216 (2013.01); H05K 3/227 (2013.01); B22F 2301/10 (2013.01); B22F 2302/25 (2013.01); H05K 2201/032 (2013.01);
Abstract

The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.


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