The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Aug. 30, 2018
Applicant:

Korea Electronics Technology Institute, Seongnam-si, Gyeonggi-do, KR;

Inventors:

Yoonjin Kim, Suwon-si, KR;

Jinwoo Cho, Seongnam-si, KR;

Kwonwoo Shin, Hwaseong-si, KR;

Yonggon Seo, Seongnam-si, KR;

Yeonwon Kim, Anyang-si, KR;

Sanghyeon Jang, Daejeon, KR;

Namje Jo, Gyeongsangbuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/20 (2006.01); H05K 1/00 (2006.01); C09D 11/00 (2014.01); H05K 1/09 (2006.01); B22F 9/24 (2006.01); C09D 11/52 (2014.01); H01B 1/22 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); C09D 11/037 (2014.01); H05K 3/02 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/095 (2013.01); B22F 1/0022 (2013.01); B22F 1/0074 (2013.01); B22F 1/02 (2013.01); B22F 9/24 (2013.01); C09D 11/037 (2013.01); C09D 11/52 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); H05K 1/097 (2013.01); H05K 3/027 (2013.01); H05K 3/1216 (2013.01); H05K 3/227 (2013.01); B22F 2301/10 (2013.01); B22F 2302/25 (2013.01); H05K 2201/032 (2013.01);
Abstract

The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.


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