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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10477670 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Mar. 09, 2016

Flexible circuit board assembly for led lamp

Applicant:

Ledlitek Co., Ltd, Sejong, KR;

Inventors:

Jeong Wook Hur, Seoul, KR;

Young Min Yoon, Gyeonggi-do, KR;

Hwang Ryong Kim, Sejong, KR;

Assignee:

LEDLITEK CO., LTD, Sejong-si, KR;

Attorneys:

Eric L. Lane

Green Patent Law

Primary Examiner:

Bao Q Truong

Int. Cl.
CPC ...
F21V 29/70 (2015.01); F21V 29/89 (2015.01); H05K 1/02 (2006.01); F21V 19/00 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01); F21K 9/00 (2016.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); F21V 19/0025 (2013.01); F21V 29/70 (2015.01); F21V 29/89 (2015.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); F21K 9/00 (2013.01); F21Y 2115/10 (2016.08); H05K 1/0209 (2013.01); H05K 1/053 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10113 (2013.01);
Abstract

A flexible circuit board assembly for an LED lamp of the present disclosure comprises: a resin layer having a strip shape; a conductive signal line layer formed from a predetermined pattern provided on the upper part of the resin layer; and a radiation layer provided on the lower part of the resin layer, having a thickness relatively thicker than that of the conductive signal line layer, and radiating the heat generated from an LED mounted on the signal line layer, wherein the signal line layer and the radiation layer are made from one material from among copper, aluminum, copper alloy and an aluminum alloy.

Find Patent Forward Citations

Hur, Jeong. (2019). Flexible circuit board assembly for led lamp (U.S. Patent No. 10477670). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10477670

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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