The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Feb. 08, 2017
Applicants:

Universite Paris-sud, Orsay, FR;

Centre National DE LA Recherche Scientifique, Paris, FR;

Universite Du Mans, Le Mans, FR;

Inventors:

Emile Martincic, Villejuif, FR;

Alexandre Houdouin, Villebon-sur-Yvette, FR;

Stéphane Durand, Pruillé-le-Chétif, FR;

Nourdin Yaakoubi, Le Mans, FR;

Elie Lefeuvre, Montreuil, FR;

Yves Auregan, Angers, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E04B 1/82 (2006.01); H04R 1/28 (2006.01); G10K 11/16 (2006.01); E04B 1/86 (2006.01); H04R 9/06 (2006.01); E04B 1/84 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2896 (2013.01); E04B 1/86 (2013.01); G10K 11/16 (2013.01); H04R 9/06 (2013.01); E04B 2001/8485 (2013.01);
Abstract

A passive sound absorber includes a cavity opening to the outside via an input direction to form a Helmholtz resonator for a first frequency. The absorber further includes at least one moving element, or wafer, suspended or held by suspensions in a position obstructing the neck in a non-sealed manner. The relative stiffness of the suspensions and the wafer is determined so that the assembly resonates in a vibration in a 'piston' movement at a second frequency different from the first frequency, achieving absorption for this second frequency or frequency range. A hybrid version includes a coil that is controlled to adjust the acoustic impedance of the absorber. An acoustic wall includes a plurality of such absorbers produced by a repetitive structure opening through perforations, each receiving such a wafer, and a method of designing and manufacturing such an absorber or wall is also provided.


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