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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10477301 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Apr. 23, 2019

Top port multi-part surface mount silicon condenser microphone

Applicant:

Knowles Electronics, Llc, Itasca, IL (US);

Inventor:

Anthony D. Minervini, Palos Hills, IL (US);

Assignee:

Knowles Electronics, LLC, Itasca, IL (US);

Attorney:

Foley & Lardner LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/00 (2006.01); H04R 11/04 (2006.01); H04R 31/00 (2006.01); H04R 1/28 (2006.01); H04R 23/00 (2006.01); B81B 7/00 (2006.01); H01L 21/78 (2006.01); H04R 19/00 (2006.01); H04R 19/01 (2006.01); H04R 19/04 (2006.01); B81C 3/00 (2006.01); B81C 1/00 (2006.01); H04R 3/00 (2006.01); H04R 1/04 (2006.01); H01L 23/15 (2006.01); H01L 23/10 (2006.01); H04R 1/22 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2892 (2013.01); B81B 3/0021 (2013.01); B81B 7/007 (2013.01); B81B 7/0038 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81B 7/0064 (2013.01); B81C 1/00158 (2013.01); B81C 1/00301 (2013.01); B81C 3/00 (2013.01); H01L 21/78 (2013.01); H01L 23/10 (2013.01); H01L 23/15 (2013.01); H04R 1/04 (2013.01); H04R 1/222 (2013.01); H04R 3/00 (2013.01); H04R 19/005 (2013.01); H04R 19/016 (2013.01); H04R 19/04 (2013.01); H04R 23/00 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/092 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1461 (2013.01); H04R 2201/003 (2013.01); H04R 2225/49 (2013.01); H04R 2410/03 (2013.01); Y10T 29/49005 (2015.01); Y10T 29/4908 (2015.01); Y10T 29/49798 (2015.01);
Abstract

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

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