The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Aug. 14, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Nobuo Ikemoto, Nagaokakyo, JP;
Atsushi Kumano, Nagaokakyo, JP;
Jerry Hsieh, Nagaokakyo, JP;
Jun Sasaki, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); H05K 3/00 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H04N 5/2254 (2013.01); H05K 3/0094 (2013.01); H05K 5/0091 (2013.01); Y10T 29/49131 (2015.01); Y10T 29/49156 (2015.01); Y10T 29/49167 (2015.01);
Abstract
A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.