IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10476531 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Dec. 15, 2017

High-frequency front-end circuit

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Isao Takenaka, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Benjamin H Elliott, IV

Int. Cl.
CPC ...
H04B 1/00 (2006.01); H04L 5/14 (2006.01); H04B 1/403 (2015.01); H04B 1/52 (2015.01); H03F 1/56 (2006.01); H03F 3/19 (2006.01); H03H 7/01 (2006.01); H03H 7/38 (2006.01); H03H 7/46 (2006.01); H04B 1/401 (2015.01); H04B 1/04 (2006.01); H03F 3/60 (2006.01);
U.S. Cl.
CPC ...
H04B 1/0057 (2013.01); H03F 1/56 (2013.01); H03F 3/19 (2013.01); H03F 3/60 (2013.01); H03H 7/0115 (2013.01); H03H 7/0138 (2013.01); H03H 7/38 (2013.01); H03H 7/463 (2013.01); H04B 1/006 (2013.01); H04B 1/0458 (2013.01); H04B 1/401 (2013.01); H04B 1/403 (2013.01); H04B 1/52 (2013.01); H04L 5/1461 (2013.01); H03F 2200/111 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A high-frequency front-end circuit includes a communication band selection circuit, a high-frequency processing circuit, and a multi-band amplifier. The multi-band amplifier amplifies high-frequency signals in a plurality of communication bands. The communication band selection circuit is connected an output end of the multi-band amplifier. The communication band selection circuit includes a communication band selection switch. The high-frequency processing circuit is connected between a first connection line connecting the multi-band amplifier and the communication band selection circuit and a ground potential. The high-frequency processing circuit includes a passive element and an impedance selection switch. The passive element is connected between the first connection line and the ground potential. A first terminal of the impedance selection switch is connected to a second connection line connecting the passive element and the first connection line, and a second terminal of the impedance selection switch is connected to the ground potential.

Find Patent Forward Citations

Loading…