The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Oct. 19, 2016
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Jun Karino, Nagaokakyo, JP;

Mizuho Katsuta, Nagaokakyo, JP;

Kosuke Ishida, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H03H 7/38 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H03H 7/38 (2013.01); H01F 27/292 (2013.01);
Abstract

An electronic component includes a multilayer body constituted by insulator layers that are laminated in a laminating direction, a primary coil including one or more primary coil conductor layers, a secondary coil including one or more secondary coil conductor layers, and a tertiary coil including one or more tertiary coil conductor layers. The primary coil conductor layers, the secondary coil conductor layers, and the tertiary coil conductor layers are arrayed in the laminating direction. The primary coil, the secondary coil, and tertiary coil constitute a common mode filter, and intervals between two among the one or more primary coil conductor layers, the one or more secondary coil conductor layers, and the one or more tertiary coil conductor layers, every two of those being adjacent to each other in the laminating direction, are not even.


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