The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jun. 19, 2018
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Jun-ichi Hashimoto, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/34 (2006.01); H01S 5/022 (2006.01); H01S 5/028 (2006.01); H01S 5/227 (2006.01); H01S 5/343 (2006.01); H01S 5/12 (2006.01); H01S 5/02 (2006.01); H01S 5/042 (2006.01); H01S 5/40 (2006.01); H01S 5/22 (2006.01);
U.S. Cl.
CPC ...
H01S 5/3401 (2013.01); H01S 5/028 (2013.01); H01S 5/02208 (2013.01); H01S 5/02268 (2013.01); H01S 5/12 (2013.01); H01S 5/227 (2013.01); H01S 5/3402 (2013.01); H01S 5/343 (2013.01); H01S 5/0201 (2013.01); H01S 5/0202 (2013.01); H01S 5/0282 (2013.01); H01S 5/02272 (2013.01); H01S 5/0425 (2013.01); H01S 5/2224 (2013.01); H01S 5/2275 (2013.01); H01S 5/4031 (2013.01); H01S 2301/176 (2013.01);
Abstract

A quantum cascade laser includes: a semiconductor substrate including principal and back surfaces; a semiconductor laminate having a laminate end face, the laminate end face and, the substrate end face extending along a reference plane intersecting a second direction that intersects the first direction; a first electrode disposed on the semiconductor laminate, the semiconductor laminate being disposed between the first electrode and the semiconductor substrate; a second electrode disposed on the back surface; a first insulating film disposed on the laminate end face, the substrate end face, and the first electrode; a metal film disposed on the first insulating film and the laminate end face, the substrate end face, and the first electrode; and a second insulating film disposed on the second electrode, and on the substrate end face, the metal film being disposed between the first insulating film and the second insulating film.


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