The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jun. 25, 2018
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, Hubei, CN;

Inventors:

Ming Zhang, Hubei, CN;

Jie Yang, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); B05D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/529 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); B05D 7/50 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/5369 (2013.01); H01L 2251/558 (2013.01);
Abstract

The invention provides an OLED packaging structure and method, wherein the OLED packaging structure comprises: a substrate disposed with OLED device; a first inorganic barrier layer formed on the substrate and covering the OLED device; an organic buffer layer formed on the first inorganic barrier layer, the organic buffer layer being doped with particles having negative thermal expansion coefficient; a second inorganic barrier layer formed on the substrate and covering the first inorganic barrier layer and the organic buffer layer. By doping the organic buffer layer with particles with negative thermal expansion coefficient to form a gradient doping organic buffer layer, the invention can reduce thermal deformation of the organic buffer layer, reduce or even eliminate the thermal expansion and deformation difference at the interface between the organic buffer layer and the inorganic barrier layer, thereby to reduce the film peeling or bubbling probability and improve packaging reliability.


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