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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10475972 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Nov. 16, 2018

Light-emitting diode package and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jin-sub Lee, Hwaseong-si, KR;

Yong-il Kim, Hwaseong-si, KR;

Han-kyu Seong, Hwaseong-si, KR;

Young-jin Choi, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Joe E Schoenholtz

Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/60 (2010.01); F21K 9/237 (2016.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); F21K 9/233 (2016.01); F21K 9/27 (2016.01); G09F 13/00 (2006.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); F21V 8/00 (2006.01); G02F 1/1335 (2006.01); F21K 9/232 (2016.01); F21K 9/275 (2016.01); F21Y 115/10 (2016.01); F21S 8/02 (2006.01); F21V 23/04 (2006.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); F21K 9/233 (2016.08); F21K 9/237 (2016.08); F21K 9/27 (2016.08); G09F 13/00 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); F21K 9/232 (2016.08); F21K 9/275 (2016.08); F21S 8/026 (2013.01); F21V 23/045 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); G02B 6/0073 (2013.01); G02F 1/133514 (2013.01); H01L 33/06 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/505 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.

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