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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10475949 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Mar. 09, 2018

Optical coupling device

Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Minato-ku, Tokyo, JP;

Inventor:

Hidetoshi Kuraya, Yokohama Kanagawa, JP;

Assignees:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Attorney:

White & Case LLP

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 31/167 (2006.01); H01L 31/0232 (2014.01); H01L 31/0203 (2014.01); H01L 25/16 (2006.01); H01L 31/16 (2006.01); H04B 10/40 (2013.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 31/167 (2013.01); H01L 23/49534 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/02327 (2013.01); H01L 31/162 (2013.01); H04B 10/40 (2013.01); H01L 23/49537 (2013.01); H01L 33/56 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

An optical coupling device includes a first lead frame, a second lead frame, a first mounting member, a second mounting member, the members respectively provided on the first lead frame and, the second lead frame a light emitter provided on the first mounting member, a light receiver provided on the second mounting member, a first wire and a second wire electrically connecting the light emitter to the first lead frame, and the light receiver to the second lead frame, and an outer resin enclosure enclosing a part of the first lead frame and the second lead frame, the light emitter, and the light receiver, wherein at least the light emitter and the light receiver in the outer resin enclosure are covered with a silicone resin cured material.

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